DesignCon 2017 to Return to Silicon Valley for its 22nd Year - Registration Now Open
Register before October 14 to save at least $400 on a conference pass
Sep 28, 2016
SAN FRANCISCO, Sept. 28, 2016 /PRNewswire/ -- DesignCon, produced by UBM LLC (UBM.L), today announced its 2017 event which will return to the Santa Clara Convention Center for its 22nd year. The event, designed by engineers for engineers, is the premier conference for deep technical training, driving chip, board and system innovation. This year's program will host more than 100 in-depth sessions spanning 14 technical tracks to deliver the most comprehensive and relevant conference program for the engineering community.
To learn more about DesignCon and to take advantage of Super Early Bird pricing, please visit: designcon.com/santaclara/passes-pricing
DesignCon 2017 will align with the event's reputation of providing the latest tools and education for the successful growth of the engineering community. This year's event will help professionals grow their design expertise and stay ahead of industry change. Attendees will learn, network and share with peers who are like-minded and passionate about their careers related to chips, boards and systems. Led by industry thought leaders, DesignCon will return with a schedule of sessions catered toward giving attendees practical solutions to their toughest challenges.
Below is a list of the 14 tracks that will be offered at this year's conference:
"Our dedication to this complex and talented community has always been evident through our evolving conference program," said Naomi Price, DesignCon Conference Content Director. "During its 21-year history, DesignCon has hosted the best and brightest engineers to educate, inspire and lead their peers toward success within an evolving industry. This year we continue that dedication with another full conference program that offers training for all career levels."
Apply for a Media Pass here: designcon.tech.ubm.com/2017/registrations/Media
SOURCE UBM LLC