NEW YORK, Dec. 5, 2014 /PRNewswire/ -- UBM Canon's EDN and EE Times editors announced the Hot Technologies of 2015 – innovations that will shape next year's technology trends and beyond. For complete coverage, visit http://www.edn.com/design/systems-design/4437806/Hot-technologies--Looking-ahead-to-2015/?_mc=pr_edn_bcs_hottech2015.
"As 2014 comes to a close, we look forward to more innovations and breakthroughs from engineers. From faceless test instruments to GaN and other newer semiconductor materials, to embedded security, wearables, 3D printing, smart lights and cars, and more, 2015 is shaping up to be a year that will see significant engineering gains and lead to an even more advanced tomorrow, thanks to engineers," said Suzanne Deffree, Executive Editor, EDN.
The Hot Technologies of 2015 cover the following topics:
- Diamonds are a power IC's best friend
- Faceless test instruments see the light
- Fusion heats up
- Embedded security rises and falls with crypto key management
- GaN: The dawn of a new era?
- Mobile payment technology reaching critical mass?
- 3D printing: To the space station and beyond
- Smart light's bright future
- ADAS takes greater control in 2015
- Wearables make hardware the new software
- Changing world requires risk management focus
- MEMS mics taking over
For the full list of the Hot Technologies of 2015, visit http://www.edn.com/design/systems-design/4437806/Hot-technologies--Looking-ahead-to-2015/?_mc=pr_edn_bcs_hottech2015.
EDN is an online community intended to help engineers get from concept to reality. EDN offers deep-dive technical content along with a community experience where the latest in design techniques, technologies, and methodologies meld with the simplest and most useful online interaction tools. EDN celebrates all that is the engineer – from deep down technical views, to informed opinions, to knowledge and schematics sharing, to creative design and all aspects of life as an engineer. From day one, EDN has been written by engineers, for engineers, feeding design know-how and experience back to the engineering community as a trusted source. EDN is part of UBM Canon, the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry.
About EE Times
EE Times is an online community that delivers the most relevant and insightful news, analysis and commentary on emerging technology, design and business trends within the global electronics industry to empower decision makers with the actionable intelligence they need to compete on the world stage. For over 40 years, EE Times has been the largest, most trusted and most respected independent information resource for anyone involved in technology and electronics engineering. Hundreds of thousands of engineers, business leaders, executives, engineering and design managers, technologists and analysts turn to EE Times and its affiliated communities and technical resources for the inspiration, ideas, connections and insight necessary to stay competitive in ever-changing global markets. EE Times is part of UBM Canon, the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry.
About UBM Canon
UBM Canon is the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the advanced manufacturing market and leverage our proprietary 1.3 million name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. UBM Canon is part of UBM plc (UBM.L) a global provider of media and information services for professional B-to-B communities and markets.
For more information on EDN or EE Times please contact:
Carly Cohen, Marketing Coordinator, EDN and EE Times
T: 212.600.3294, E: firstname.lastname@example.org
SOURCE UBM Canon